This standard describes a baseline set of acceptance tests for use in qualifying electronic components as new products, a product family, or as products in a. EIA/JEDEC standards and publications contain material that has been prepared, Within the JEDEC organization there are procedures whereby an EIA/JEDEC. additional reliability stress testing (i.e., JESD22 A and JESD47 or the semiconductor manufacturer’s in-house procedures). Passing the reject criteria in this.

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It should be noted that this standard does not cover or eja to thermal shock chambers. This publication contains a set of frequently recommended and jeds JEDEC reliability stress tests.

This standard establishes the information required by semiconductor users from IC manufacturers and distributors in order to judge whether a semiconductor component is fit for use in their particular application.

Projections can be used to compare reliability performance with objectives, provide line feedback, support service cost estimates, and set product test and screen strategies to ensure that the ELFR meets customers’ requirements.

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The standard establishes a symbol and label that will gain the attention of those persons who might inflict electrostatic damage to the device. This test is conducted to determine the ability of components and solder interconnects to withstand mechanical stresses induced by alternating high- and low-temperature extremes.

A form of high temperature bias life using a short duration, popularly known as burn-in, may jessd used to screen for infant mortality related failures. This document describes transistor-level test and data methods for the qualification of semiconductor technologies. This document was written with the intent to provide information for quality organizations in both semiconductor companies ei their customers to assess and make decisions on safe ESD level requirements.


This document describes backend-level test and data methods for the qualification of semiconductor technologies. For technologies where there is adequate field failure data, alternative methods may be used to establish the early life failure rate.

The test method can also be used to shear aluminum iea copper wedge bonds to a die or package bonding surface. Formerly known as EIA This standard will be useful to anyone engaged in handling semiconductor devices and integrated circuits that are subject to permanent damage due to electrostatic potentials.

Pictures have been added to enhance the fail mode diagrams.

This standard provides a method for determining solid state devices capability to withstand extreme temperature cycling. This fully revised test provides a means for determining the strength of gold and copper ball bonds to a die or package bonding surface, and may be performed on pre-encapsulation or post-encapsulation parts. It is intended to establish more meaningful and efficient qualification testing. It establishes a set of data elements that describes the component and defines what each element means.

Although endurance is to be rated based upon the standard conditions of use for the class, the standard also sets out requirements for possible additional use conditions as agreed to between manufacturer and purchaser. This Test Method establishes an industry standard preconditioning flow for nonhermetic solid state SMDs surface mount devices that is representative of a typical industry multiple solder reflow operation. Please see Annex C for revision history.

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Terms, Definitions, and Symbols filter JC The high temperature storage test is typically used to determine the effects of time and temperature, under storage conditions, for thermally activated failure mechanisms and time-to failure distributions of solid state electronic devices, including nonvolatile memory devices data retention failure mechanisms.


The symbol contained in this label, jrsd may be used on the device itself, shows a hand in a triangle with a bar through it. Registration or login required.

Thermally activated failure mechanisms are modeled using the Arrhenius Equation for jeds. Assembly level testing may not be a prerequisite for device qualification; dia, if the effect of assembly conditions on the component is not known, there could be reliability concerns for that component that are not evident in component level testing.

This test method also provides a reliability preconditioning sequence for small SMDs that are wave soldered using full body immersion.

The purpose of this standard is to define a procedure for performing measurement and calculation of early life failure rates. The document is organized in different sections to give as many technical details as possible to support the purpose given in the abstract. Displaying 1 – 20 of 38 documents. Stress 1 Apply Thermal. This standard is intended to identify a core set of qualification tests that apply specifically for Power Amplifier Modules and their primary application in mobile devices such as cellular phones.

These tests are used frequently in qualifying integrated circuits as a newproduct, a product family, or as products in a process which is being changed. Search ria Keyword or Document Number.